SOLDERING & SURFACE MOUNT TECHNOLOGY（焊接和表面贴装技术杂志）影响因子_期刊投稿发表

期刊简介

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.

焊接和表面贴装技术致力于在这一重要领域的知识和专业技术体系内为研究和应用的进步做出重要贡献。《焊接与表面安装技术》对其姊妹出版物的赞扬《电路世界》和《微电子国际》。该杂志涵盖了SMT的各个方面，从合金、锡膏和助焊剂到可靠性和环境影响，目前正在为无铅焊料和工艺的新知识提供重要的传播途径。该杂志包括一个多学科研究的关键材料和技术，用于组装国家的最先进的功能电子设备。重点是通过焊接组装器件和互连组件，同时还包括广泛的相关方法。

《SOLDERING & SURFACE MOUNT TECHNOLOGY》期刊已被查看：次