MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING（半导体加工中的材料科学杂志）影响因子_期刊投稿发表

期刊简介

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

半导体加工中的材料科学提供了一个独特的论坛，讨论功能材料和器件的新工艺、应用和理论研究，为（光）电子、传感器、探测器、生物技术和绿色能源。每期的目的是提供目前的见解、新的成就、突破和未来的发展趋势等不同领域的快照，如微电子、能源转换和储存、通信，生物技术、（光）催化、纳米和薄膜技术、混合和复合材料、化学加工、气相沉积、器件制造和建模，这些都是先进半导体加工和应用的支柱。内容包括：用于亚微米器件的先进光刻技术;蚀刻和相关主题;离子注入;损伤演变及相关问题;等离子体和热CVD;快速热处理;先进的金属化和互连方案;薄介电层、氧化;溶胶-凝胶处理;化学浴和（电）化学沉积;化合物半导体加工;新型非氧化物材料及其应用;（大）分子和杂化材料;分子动力学、从头计算方法、蒙特卡罗等;用于分立和集成电路的新材料和工艺;磁性材料和自旋电子学;异质结构和量子器件;半导体的电学和光学性质的工程;晶体生长机理;可靠性、缺陷密度、本征杂质和缺陷。

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