MICROELECTRONICS INTERNATIONAL Q4区

期刊简介

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:• Advanced packaging• Ceramics• Chip attachment• Chip on board (COB)• Chip scale packaging• Flexible substrates• MEMS• Micro-circuit technology• Microelectronic materials• Multichip modules (MCMs)• Organic/polymer electronics• Printed electronics• Semiconductor technology• Solid state sensors• Thermal management• Thick/thin film technology• Wafer scale processing.

微电子国际提供了一个权威的、国际性的和独立的论坛，对与先进封装、微电路工程、互连、半导体技术和系统工程有关的研究与开发、应用、工艺和当前实践进行批判性评估和传播。它是一个最新、全面和实用的信息工具。编辑John Atkinson博士欢迎向期刊投稿，包括技术论文、研究论文、案例研究和评论论文。微电子国际是一个多学科的研究领域，研究与微型电子器件和先进封装的设计、制造、组装和各种应用相关的关键技术和相关问题。涵盖的广泛主题包括：·先进封装·陶瓷·芯片连接·板上芯片（COB）·芯片级封装·柔性基板· MEMS·微电路技术·微电子材料·多芯片模块（MCM）·有机/聚合物电子学·印刷电子学·半导体技术·固态传感器·热管理·厚/薄膜技术·晶圆级加工。

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